Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study

In high power electronics packaging, sintered silver nanoparticle joints suffer from thermal-humidity- electrical-chemical joint driven corrosion in extreme environments. this paper, we conducted aging tests on nanoparticles under high-temperature, high-humidity, and high-sulphur conditions. The results show that: (1) the sample dry conditions at a temperature exhibited highest degree of sulphidation; (2) Reactive force field (ReaxFF) molecular dynamics (MD) simulations sulphidation revealed layer was formed by atoms upward migration. This work paves way for further investigation considering multi-physics coupling effects.